Innovation of packaging materials for optocoupler technology

Optocoupler (abbreviated as optocoupler) is an important electronic component that can convert optical signals into electrical signals and is widely used in various electronic devices. The packaging material of optocouplers has a crucial impact on their performance, therefore, innovation in packaging materials has always been an important direction for the development of optocoupler technology.
Preparation process of high-temperature resistant packaging materials
A preparation process for high-temperature resistant packaging materials for automotive optocouplers, including fiberization and high-temperature resistant modification of epoxy resin, in-situ polymerization of high-temperature resistant additives on modified epoxy resin, and surface modification of gas-phase white carbon black reinforced heat-resistant epoxy resin. This process uses electrospinning technology to produce epoxy resin nanofiber membranes, which have good heat resistance and form a three-dimensional skeleton structure with uniform pore size inside. The epoxy resin nanofiber membrane is immersed in a modified solution, and the isocyanate groups in the modified solution fully contact and react with the hydroxyl groups in the epoxy resin, forming a tightly connected cross-linked network structure, enhancing the connectivity between the molecular chains of the epoxy resin, greatly improving the heat resistance of the modified epoxy resin, and thus enhancing the high temperature resistance of the packaging material.
Improvement of heat dissipation performance
Shenzhen Qunxin Microelectronics Co., Ltd. has obtained a patent for an optocoupler packaging bracket, which includes a bracket body, plastic skin, heat dissipation mechanism, and packaging unit. By applying voltage to two piezoelectric ceramics, the two metal plates connected to them undergo periodic synchronous reverse deformation, thus completing the working cycle of jet and suction under the setting of the intake groove and nozzle, cooling the bottom of the bracket, improving heat dissipation performance, and simplifying the structure to save costs.
Breakthrough in Efficient Optical Coupling Technology
The breakthrough of efficient optical coupling technology will greatly promote the progress of photonic chip packaging. The design of micro nano optical technology, silicon-based photonics technology, and integrated optical devices are all core technologies for efficient optical coupling technology. The application fields of these technologies include data centers, communication networks, and medical imaging. With the continuous advancement of efficient optical coupling technology, the packaging technology of photonic chips in the future will develop towards higher integration, lower loss, and stronger adaptability.